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Msensor engineer talks about MEMS inertial sensors
High-precision inertial sensors are mainly used for tilt, acceleration, and vibration measurement in industrial, defense, and aerospace fields. Inertial sensors, as MEMS devices, are based on single crystal silicon sensor elements and are manufactured using the latest micro-machining technology.
The micro-machining processes used in various inertial sensor products may differ, but each has its own characteristics.MsensorThe micro-machining process developed by the company for MEMS products has launched an innovative product series including accelerometers and other inertial sensors, combining the advantages of previous versions..
This will help improve the performance of MEMS products, significantly enhance the cost-performance ratio, and be used in more new applications such as geological engineering, condition monitoring, navigation, and robotics.
What can high-precision MEMS accelerometers do?
Micro MEMS accelerometers can measure the acceleration of objects in three dimensions in space.
MEMS inertial sensors have proven to be very robust, reliable, fast, and temperature-stable advanced products, capable of detecting minimal changes in position and acceleration.
The inclinometer in the above image can achieve extremely high resolution, even detecting the deflection caused by a single hair with a diameter of 100μm passing through a 10-meter-long wooden board, equivalent to a deflection of only 0.0005° (2 arc seconds or 10μm/m).
Digital Future
Key technologies of the Internet of Things include MEMS sensors. Continuous digitization drives MEMS accelerometers and inclinometers to join in. For example, future inertial sensors will be able to achieve smart programming and will be equipped with microcontrollers, micro batteries, or micro wireless RF chips to send measurement data online.
Currently,Msensorthe application fields of the launched high-precision inertial sensors include:
(1) Monitoring the status of buildings;
(2) Monitoring wind power plants, solar power plants, high-voltage lines, dams, pipelines, etc.;
(3) Monitoring oil and gas onshore/offshore infrastructure, nuclear power plants, gas stations, and hydropower stations;
(4) Stabilization and alignment systems;
(5) Infrastructure and transportation;
(6) Navigation
Capacitive inertial sensors and the underlying technological concepts: small size, low production cost, low operating power consumption
MEMS inertial sensors can perform capacitive measurements of tilt angles, acceleration, and vibration, mainly relying on advanced MEMS technology and micro silicon-based sensors. The width of the formed spring mass block is only a few micrometers.
During acceleration, the mass block suspended on the spring changes, allowing for the measurement of capacitance changes. The ASIC reads this capacitance change value and provides the measurement.
In the sensor production process, the mass block and spring are separated from the silicon substrate. The thickness of such a structure is usually only a thousandth of a millimeter.
Due to their small size, MEMS can achieve mass production and consume very little energy.
Core technology of MEMS inertial sensors
(1) Single crystal silicon sensor chip;
(2) High-performance ASIC (Application-Specific Integrated Circuit) chip;
(2) The packaging of the above two chips.
MsensorPerformance data of MEMS inertial sensors
Core of inertial sensors: single crystal silicon sensor chip
The core of almost all MEMS devices is the silicon-based sensor chip, usually manufactured using bulk micromachining or surface micromachining processes. However, First Sensor has adopted new technologies such as HARMS (High Aspect Ratio Microstructures) and AIM (Air Gap Insulated Microstructures).
The former minimizes cross-axis sensitivity by achieving microstructures with high aspect ratios. The latter minimizes parasitic capacitance by using air gap isolation components. Therefore, MEMS technology can provide more advantages than all traditionally manufactured inertial sensor combinations.
MsensorAdvantages of inertial sensors in measuring acceleration, tilt, and vibration
(1) Flexible MEMS design: measurement range of 1~15 g;
(2) Four standard sensors: four different measurement ranges, optimal application range (spring mass principle);
(3) One sensor measures two axes: easy to use;
(4) High aspect ratio silicon-based microstructures: ultra-low X-axis sensitivity; fatigue resistance; long-term stability;
(5) Air gap insulated microstructures: limited parasitic capacitance; limited mechanical stress due to the absence of SiO2 layer; excellent temperature stability, easy to calibrate.
Comparison results of different processing technologies
Sensor brain: high-performance ASICChip
As mentioned above, the silicon-based sensor chip is the core of MEMS inertial sensors, while the ASIC chip is the brain. The ASIC chip reads the capacitance signal from the silicon-based sensor chip and transmits the measurement values digitally.
Features of high-performance ASIC chips include:
(1) Extremely low noise capacitance detection;
(2) High resolution in a high dynamic range;
(3) Optimal support for nominal and differential capacitance ranges;
(4) Flexible signal filters;
(5) Digital SPI interface (configurable sensor ASIC system, reading sensor data).
Sensor housing: sealed housing
The housing that encapsulates the two chips must not only allow the sensor to function but also be cost-effective for production and implementation.
The characteristics of MEMS enclosures are:
(1) Internal design can be adjusted for various applications;
(2) Sealed enclosure;
(3) Ceramic substrate;
(4) Economical and efficient small to medium batch production.
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